Product Change Notices |
| Archive List of PCN's: |
| PCN # |
Issue Date |
Subject |
| PCN # 08-09 |
08/20/08 |
Tray Pocket Dimension Change for PT7C5009Axx-xDE |
| PCN # 08-08 |
08/20/08 |
Packing Method Improvement for Die Sale Products Packed by 3'' Trays" |
| PCN # 08-07 |
08/20/08 |
The molding compound change from Non-halogen free to Halogen free for products PT7C5024ALxTAE |
| PCN # 08-06 |
06/25/08 |
Product Discontinuance of Below Parts |
| PCN # 08-05 |
06/19/08 |
Packing Material Improvement for PT7C50XXXXX-XDE |
| PCN # 08-04 |
03/13/08 |
The Mold Compound Material Change for SOT23-6/5/3L with PTI package code(TA) and SOIC-16/8L with PTI package code(W) |
| PCN # 08-02 |
03/06/08 |
Additional Assembly Site for TSSOP-8L Pb-free package with PTI package code (L) |
| PCN # 08-01 |
01/30/08 |
Epoxy Mold Compound (EMC) change for laser marking improvement and tape & reel orientation change for PT7C5022AXATAE,PT7C5021AXTAE, PT7C5021KDTAE, PT7C5023BNDTAE |
| PCN # 07-19 |
12/25/07 |
PT7M743XTAE die revision change from "X" to "U" |
| PCN # 07-17 |
12/07/07 |
PT7C4363P/WE die revision change from "X" to "V" |
| PCN # 07-16 |
11/23/07 |
Product Discontinuance of PT8A2612PE, PT8A2612WE, PT8A2612DE |
| PCN # 07-15 |
09/10/07 |
PT7V4027DE tray size change from 2 inch to 3 inch |
| PCN # 07-14 |
08/02/07 |
Product Discontinuance of PT7C5509AN1DE, PT7C5509AN1WE |
| PCN # 07-13 |
08/02/07 |
Product Discontinuance of PT8T9783DE, PT8A9783PE, PS8A1201PE, PS8A1201WE, PS8A1211PE, PS8A1211WE, PT8A2703DE, PT8A2703WE, PT8A2713SE |
| PCN # 07-12 |
07/18/07 |
Product Discontinuance of PT8A3261PE, PT8A3203PE, PT8A3206PE, PT8A3207PE, PT8A3209PE, PT8A3210PE, PT8A3212PE, PT8A3215PE |
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